Removing copper tin needle crystals from solder bath

In solder-cut-solder systems there is a risk that the second solder bath, after the cutter, will collect too much foreign metal. When the copper content is more than 0.3%, copper-tin crystals will be formed. The needle shaped crystals can give short circuits between joints, which can be difficult to find due to their small dimensions. There is an easy method to remove these crystals from the solder bath which will be described.