This document describes general guidelines and attention points for PCB design regarding selective soldering. The guidelines can be applied for the different selective process for both SnPb and lead-free solders.
ITW EAE Support Center
Related Articles
- Cu Erosion in Liquid Soldering Processes
- General Information about Designing for Solderability
- Joint Solderability Demands for Lead-free Wave Soldering
- Physics of Critical Failure Mechanism
- Soldering Machine Capacity
- Solder Spikes on Long Leads
- Skipped Measuring Solderpads in Wave Soldering
- Lean Joints at Wave Soldered Chip Components
- Flux Application Control
- Preheating of PCB's
- Lead-free Compatibility
- Matt Solderjoints after Lead Free Wave Soldering
- Solder Webbing
- Centurion Heat Load
- Skipped Measuring Pads after Wave Soldering
- Soldering Pallets
- Residues on the Soldermask after Wavesoldering
- Solderballs in Wave Soldering
- Solderability in Relation to PCB Design
- The Allowable Permanent Mechanical Load for Solderjoints on PCBs
- Solderable Coatings
- Spikes and Flags on Solderjoints
- The Case of Poor Hole Filling with Lead Free Soldering
- The Effect of Different Fluxes on Soldering of OSP Protected Boards Soldering
- The Effect of Radiation Wave Length on Preheating Result
- The Mechanisms of Solderbridging
- The Origin of Solderball Formation in Wave Soldering
- The Origin of Solderbridging in Dip and Wave Soldering
- Topside Re-melt or Re-reflow
- Wave Process