The attached document demonstrates what we have done to achieve selective soldering of fine pitch components on high thermal mass boards.
ITW EAE Support Center
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- Topside preheating ins and outs
- Setting the width of the infeed section finger conveyor and outfeed section
- Setting of a smart wave
- Mechanical setting of chip and smart wave
- Fixing thermocouples for wave and reflow soldering
- Exchanging a solderpot during production
- Notes on general settings for a wave soldering process
- Some notes on the allowable load on the conveyor fingers
- The use and behavior of different preheating systems in wave soldering
- Determination of dropjet nozzle capacity
- How to make a flux usable for the dropjet fluxer
- Multiflux Dogbone Effect
- Preheater Configuration
- Why optimising the wave soldering process is no general panacea of insufficient hole filling
- The use of electromagnetic pumps in soldering equipment
- The function of nitrogen in soldering electronics
- Glowing dross residues of the solderbath
- Solderpot efficiency
- Blowholes in (lead-free) wave soldering
- Flux residues on soldered boards
- Assessment of the quality of wave soldered joints
- Flux penetration in connectors or relays
- "Fixed" position of SMDs during re-reflow