When the PCB exits from the soldering unit, it sometimes appears that the process did not quite proceed as we wished. Attached we will discuss the cause of solder bridging. The main reason for this kind of defects lies in the inappropriate solder drainage conditions. This can have several reasons. One of the most common reasons is remaining oxides from the solder at the exit area from the soldering wave due to lack of flux activity, e.g. because of a wrong composition or distribution.
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