Measuring pads have normally no mounting hole or outgassing hole in the pad. If the pad aperture dimension in the solder resist is relatively small, there is a risk that the solderwave skips that pad. That risk increases if the solder resist layer is thicker than 35 microns and if the aperture has a relatively sharp edge. Finally if the solderability of such a pad is not optimal, skipped joints will be very common in that case.
The attached sheet will explain the cause(s).