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Joint Solderability Demands for Lead-free Wave Soldering

With the introduction of lead-free wave soldering we are often faced with a hole fill that is not as good as when tin-lead solder was used.  There is no simple panaceas to improve the hole fill of joints that were already designed "at the edges" for the tin-lead wave soldering process.  For such joints a new design, based on this new thermal demands, is necessary.

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Jeff is the author of this solution article.

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