ITW EAE Support Center
Information Sheets
Information sheets
- Difficulties and how to avoid them when soldering PCBs with non plated through holes
- General information about sagging of printed circuit boards during the soldering process
- How to keep solderpad holes open in non-plated mounting holes
- Improvement of wave soldering of SOT23 by enlarging soldering pads
- Lead free silver containing solder alloys
- Low tin content in tin-bath solders
- Explication of a circular crack in a topside solder fillet using a model
- Mono-stable and Bi-stable solderjoints
- Reliability of joints in view of the process settings used in wave soldering
- Mechanism of crack formation at the surface of solderfillets